• COMPANY PROFILE

    ABOUT BONOTEC


    Bonotec Electronic Materials is an adhesive solution provider which specializes in packaging and bonding materials in the electronics field. Our products are widely used across numerous industries with the focus on electronics assembly and semiconductor packaging.

    Starting from 2009, Bonotec's industry leading ExBond series have been widely adopted in die-attach and assembly.With its strong in-house R&D capabilities, Bonotec has effectively solved the contradiction between bonding performance and application performance.In addition, Bonotec has successfully penetrated new market segments previously occupied by foreign brands, and is now a well-known national brand (in the domestic market).

    Bonotec has continuously increased both in size and revenue annually. In 2011, we added ExSilica (silicone adhesive) and ExSeal (Sealant) to  further enrich our product portfolio and meet our clients'needs.Furthermore, we will continue to carefully manage our supply chain, providing significant values to our suppliers and clients, and put more efforts in the development for various types of advanced packaging solutions. In the future, Bonotec will continue to focus on platform development, product optimization, process and quality control and the innovation and improvement of solutions.

    At the same time, we will also look into other market segments to identify opportunities for potential clients in need of our cutting-edge products and real-time service.

    • 2009

      FOUNDED ON
    • 180 +

      PRODUCT NUMBER
    • 20 +

      CUSTOMER NUMBER

    Vision

    CORPORATE PHILOSOPHY

    Dream with Passion Success through Concentration

    DEVELOPMENT DIRECTION

    Focus on becoming the most competitive brand of electronic adhesives

    CORPORATE VISION

    Our innovation is not limited to our products, also includes everything possible.

    CORPORATE CULTURE

    The world is small and the ideal is big. We create with our heart, for the world, for tomorrow.

    The Development Course

    2019

    In 2018, the number of employees of the company is more than 100 and we received round B financing.

    2018

    In 2018, the number of employees of the company is more than 100 and we received round B financing.

    2017

    In 2017, we won the Specialized Enterprise in Shanghai.

    2016

    In 2016, we was awarded the national patents on more than 10 inventions and relocated Xinzhuang Industrial Zone.

    2015

    In 2015, A+ Rotary Wind Investment Fund was introduced and we get the first overseas order.

    2014

    In 2014, A Rotary Wind Investment Fund was introduced.

    2013

    In 2013, we developed a number of new products and sales break through tens of millions.

    2012

    In 2012, we passed ISO14001 Environmental System Certification and acquired three registered trademarks.

    2011

    In 2011,we passed ISO 9001 Quality System Certification and achieved "State-level High-tech Enterprises".

    2010

    In 2010, we got the first order from BOE(Beijing) and introduced angel investment in December.

    2009

    In 2009, Beno was founded and sent samples to the first customer in August.

    Company Honor

    Complete the registration of scientific and technological achievements of "special functional silicone conductive adhesive"
    Pass ISO 9001:2015
    Obtained 2018 environmental management system certification
    Complete innovation fund project
    Obtain certificate of high tech enterprise
    Won the eighth Zhizheng cup
    Obtained the certificate of "specialization and innovation" of Shanghai
    Obtained the patent certificate of invention "epoxy functional silicone conductive adhesive for led"
    The invention patent certificate "high adhesive strength bismaleimide epoxy conductive adhesive for led"
    Obtained the patent certificate of invention "silicone bismaleimide conductive adhesive for led"
    Obtained the patent certificate of invention "epoxy functional silicone conductive adhesive of amino curing system for led"
    Obtained the patent certificate of invention "silicone bismaleimide epoxy conductive adhesive for led"
    Obtained the patent certificate of invention "silicone imide insulation adhesive for led"
    Obtained the patent certificate of invention "silicone imide conductive adhesive for led"

    Organizational Structure

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